Grinding discs are important process equipment for the production of silicon wafers for VLSI in the semiconductor industry.
The commonly used cast iron or
carbon steel grinding discs have a low service life and a large thermal expansion coefficient. In the process of processing silicon wafers, especially during high-speed grinding or polishing, the flatness and parallelism of the silicon wafers are difficult to guarantee due to the wear and thermal deformation of the
grinding disc. Grinding discs using silicon carbide ceramics can be ground and polished at a high speed due to the high hardness of the grinding discs and the low wear and thermal expansion coefficient of the silicon wafer. Especially in recent years, the size of silicon wafers has become larger and larger, and higher requirements have been placed on the quality and efficiency of silicon wafer grinding. The use of
silicon carbide ceramic grinding discs will greatly improve the quality and efficiency of silicon wafer grinding. At the same time, the
silicon carbide ceramic grinding disc can also be used to grind and polish the plane of sheet or bulk objects of other materials.