Grinding discs are important process equipment for the production of silicon wafers for VLSI in the semiconductor industry.

As a type of grinding wheel, the cutting disc is mainly composed of a bonding agent to consolidate ordinary abrasives into a certain shape (mostly circular, with a through hole in the center), and have a certain strength.

In order to choose the most suitable grinding wheel for the current job, many factors must be considered.

Follow best practices and safety guidelines when using hand tools

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cutting wheel belong to the grinding wheel. They are made of abrasive and bond resin for cutting ordinary steel, stainless steel and non-metallic materials. They are divided into resin cutting wheel and diamond cutting wheel.